IO Circuit Design & Evaluation

Due to the limitation of silicon process developments, 3D chips that use stacked multiple dies can be a solution to enhance circuit density. In this case, the signal/power integrity is the key to succeeding the 3D chips. IO circuits are used to transfer to and receive from data. To enhance the signal/power integrity, the suitable IO circuits should be adopted. Based on the experience in Samsung Electronics, IO circuit design & evaluation will be researched.